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Regional High-Level Summit for University Presidents & Senior Policy Makers on Creating Enabling Innovation Environment (EIE) for Intellectual Property & Technology

CodeWIPO/HL/IP/OSA/19
Date et lieu25 novembre au 27 novembre 2019 (Osaka, Japon) En présentiel
Thème(s)Fonds fiduciaire mondial du Japon pour la propriété industrielle

Documents de réunion

CodeTitre(s)Fichier(s)
WIPO/HL/IP/OSA/19/INF/1EnglishProgramProgram, Document complet (pdf)
WIPO/HL/IP/OSA/19/INF/2EnglishGeneral Information (GI)General Information (GI), Document complet (pdf)

Autres documents connexes

Titre(s)Fichier(s)
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WIPO/HL/IP/OSA/19//S1/7/1EnglishSession1.7: Panel Session - EIE Project Updates - “Spokes” to Present on Institution Updates and Needs in moderated discussion - MALAYSIA - Mr. Mohd Shahir ShamsirSession1.7: Panel Session - EIE Project Updates - “Spokes” to Present on Institution Updates and Needs in moderated discussion - MALAYSIA - Mr. Mohd Shahir Shamsir, Document complet (pdf)
WIPO/HL/IP/OSA/19/S1/7/2EnglishSession1.7: Panel Session - EIE Project Updates - “Spokes” to Present on Institution Updates and Needs in moderated discussion - SRI LANKA - Mr. L S K HettiarachchiSession1.7: Panel Session - EIE Project Updates - “Spokes” to Present on Institution Updates and Needs in moderated discussion - SRI LANKA - Mr. L S K Hettiarachchi, Document complet (pdf)
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