Survey on the Implementation of WIPO Standard ST.91

Survey documents

Collated responses | IPO responses | Survey questionnaire

Collated results

This survey collects information from Industrial Property Offices (IPOs) on their implementation of WIPO Standard ST.91.

Purpose: gather and share information on IPOs’ practices of ST.91 implementation
Conducted: March to April 2024
Survey approved: eleventh session of the Committee on WIPO Standards (CWS)

Notes

This data is presented as provided by the respondent. If you have questions about a particular respondent's data, please contact that Office for more information.
Empty table cells mean that the respondent did not answer that part of the question. Likewise, a respondent with no entry on a particular question means they did not answer that question.

Survey contents

Click an item to jump to the responses

Survey respondents
1. Does your Office currently use 3D models, 3D images or 3D chemical structures?
1.1. If yes, for what IP rights?
1.2. Does your Office implement WIPO Standard ST.91 within its work?
2.1. What formats of 3D models, 3D images or 3D chemical structures does your Office currently accept for each IP right?
2.2. What software does your Office currently use for the visualization of 3D models, 3D images or 3D chemical structures during the examination process? Please specify.
2.3. What formats of 3D models, 3D images or 3D chemical structures does your Office currently use for the electronic publication for each IP right operated by Office?
2.4. What software does your Office currently use for the electronic publication of 3D models, 3D images or 3D chemical structures? Please specify.
2.5. What formats of 3D models, 3D images or 3D chemical structures does your Office currently use for the paper publication for each IP right?
2.6. Does your Office carry out search for the comparison of the 3D models and 3D images with 3D
models and 3D images during the examination process and if so, in what formats for each IP right?
2.7. What software does your Office currently use for the comparison of the 3D models and 3D images with 3D models and 3D images during the examination process? Please specify.
2.8. Does your Office carry out search for the comparison of the 3D models and 3D images with 2D
images during the examination process and if so, in what formats for each IP rights?
2.9. What software does your Office currently use for the comparison of the 3D models and 3D images with 2D images during the examination process? Please specify.
3.1. Please describe existing practices or future plans for using 3D models, 3D images or 3D chemical structures within your Office.
3.2. Please describe existing practices or future plans relating to the implementation of WIPO Standard ST.91 within your Office.
4. Any other comments, please specify.

Survey respondents

ST.3 Code	Country or Office
AU	Australia
BG	Bulgaria
BT	Bhutan
CA	Canada
CZ	Czech Republic
DE	Germany
EA	Eurasian Patent Organization (EAPO)
EE	Estonia
EM	European Union Intellectual Property Office (EUIPO)
EP	European Patent Office (EPO)
GB	United Kingdom
GM	Gambia
HR	Croatia
HU	Hungary
IT	Italy
JP	Japan
KR	Republic of Korea
LT	Lithuania
NA	Namibia
RU	Russian Federation
SK	Slovakia
SY	Syrian Arab Republic

1. Does your Office currently use 3D models, 3D images or 3D chemical structures?

ST.3 Code	Response
AU	Yes
BG	No
BT	Yes for Industrial Design and Patent
CA	Yes
CZ	No
DE	Yes
EA	Yes
EE	Yes
EM	Yes
EP	No
GB	Yes
GM	No
HR	No
HU	No
IT	No
JP	No
KR	Yes
LT	No
NA	No
RU	Yes
SK	No
SY	No

1.1. If yes, for what IP rights:

ST.3 Code	Response	Other (please specify)
AU	Industrial Designs	Yes. Designs for 3D models, drawings, and photos are the preferred formats for representations. In some cases, we do accept specimens and 3D models with design applications. However, it is important to note that while we can use a 3D model as a visual aid during the examination process, it won't be considered an official representation. We do not currently use 3D models, images or chemical structures for trade marks.
BG
BT
CA	Inventions
CZ
DE	Trademarks
EA	Industrial Designs Inventions
EE	Trademarks Industrial Designs Inventions Utility models
EM	Trademarks Industrial Designs
EP
GB	Trademarks	The UK IPO accepts 3D Models and 3D Images for trade marks only. These can be viewed on the UK IPO Internet Case Enquiry service but not via the trade marks journal.
GM
HR
HU
IT
JP
KR	Industrial Designs
LT
NA
RU	Trademarks Industrial Designs Inventions Utility models
SK
SY

1.2. Does your Office implement WIPO Standard ST.91 within its work?

ST.3 Code	Response	Additional Comments:
AU	No	No – additional comments below.
BG	No
BT	Partially	For Industrial Design and patent
CA	No	CIPO does not manage, store, process or exchange 3D models or images. However, CIPO does search and examine 3D chemical structures
CZ	No
DE	Partially
EA	Partially
EE	Partially
EM	Partially	EUIPO supports two of the formats recommended by the standard for trademark and design application, OBJ and STL, but it also supports the X3D format, which is not currently recommended in the standard. The maximum file size limit is stablished in 20MB.
EP	No
GB	No	The UK IPO is carrying out a major transformation program. Implementation of ST.91 will be considered in the next phase of the program.
GM	Partially
HR	No
HU	No
IT	No
JP	No
KR	Yes, fully
LT	No
NA	No
RU	Yes, fully
SK	No
SY	No

2.1. What formats of 3D models, 3D images or 3D chemical structures does your Office currently accept for each IP right?

ST.3 Code	None, my Office doesn’t operate this type of IP right	None, my Office doesn’t accept 3D models, 3D images or 3D chemical structures for this type of IP right	3D PDF	IGES	OBJ	STL	STEP/STP	U3D	MOL	CDX	Other (please specify):
AU	Trademarks		Industrial Designs								Designs - for the submission of 3D image designs, the accepted file format is exclusively PDF limited to 40 MB per file. It is worth noting that in addition to PDF, the acceptable file formats for design images encompass .jpg, .jpeg, .png, .tif, and .tiff. Trade marks – we do not accept any formats of 3D models, images or chemical structures at this stage.
BG		Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Industrial Designs, Inventions (except 3D chemical structures), Utility models, Inventions (3D chemical structures)
BT	Trademarks	Trademarks	Industrial Designs, Inventions (3D chemical structures)
CA		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)									For inventions (Patents) we search and examine 3D chemical structures using a tool called STN.
CZ
DE		Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)			Trademarks	Trademarks					X3D (it should be discussed to include this format in ST.91, due to the use of this format within the European Union)
EA	Trademarks, Utility models, Integrated circuit topology							Industrial Designs, Inventions (except 3D chemical structures), Inventions (3D chemical structures)
EE			Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models
EM	Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)				Trademarks, Industrial Designs	Trademarks, Industrial Designs					X3D, both for Trademarks and Industrial Designs
EP
GB	Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)			Trademarks	Trademarks					The UK IPO also accepts X3D files (as per ST.91) which is not listed above. Integrated Circuit Topology Rights (known in the UK as Semi-Conductor Topography Rights) are an unregistered right in the UK so the UK IPO does not receive any applications/models or images in connection with this right type.
GM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)										N/A
HR		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
HU	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
IT
JP	Integrated circuit topology	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Inventions (3D chemical structures)
KR				Industrial Designs	Industrial Designs	Industrial Designs	Industrial Designs
LT		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
NA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
RU		Integrated circuit topology	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models	Inventions (3D chemical structures)	Inventions (3D chemical structures)
SK	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
SY	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)

2.2. What software does your Office currently use for the visualization of 3D models, 3D images or 3D chemical structures during the examination process? Please specify:

ST.3 Code	Response
AU	Designs allow customers to upload a PDF that contains a 3D model. These are viewed using Adobe Acrobat Trade marks do not allow customers to upload 3D models, as such do not incorporate any software for this purpose.
BG
BT	Industrial Property Automation System (IPAS)
CA	STN for searching chemical structures
CZ
DE	web browser is used for visualizing files containing 3d models. The following 3rd party javascript libraries are used: X3DOM for X3D files and jsc3d-library for Wavefront obj and STL (both binary and ascii) files
EA	STP Viewer FreeCAD
EE	-
EM	Windows 3D Viewer and Paint 3D, depending on the format.
EP
GB	The UK IPO uses 3rd party JSON script libraries for the visualisation of 3D Models & 3D Images for Trade Marks
GM	N/A
HR	n/a
HU	NONE
IT
JP	JPO currently doesn't use software for the visualization of 3D models, 3D images or 3D chemical structures during the examination process.
KR	CADian Viewer(developed by a domestic company)
LT	-
NA	None
RU	Rospatent uses the in-house developed information system, specifically designed for the IPO given the experts needs and requirements, including visualization and search modules.
SK	-
SY	None

2.3. What formats of 3D models, 3D images or 3D chemical structures does your Office currently use for the electronic publication for each IP right operated by Office?

ST.3 Code	None, my Office doesn’t operate this type of IP right	None, my Office doesn’t publish information of this type of IP right electronically	None, my Office doesn’t publish information of 3D models, 3D images or 3D chemical structures electronically even if they were accepted	2D images received by my Office from the source 3D models or 3D images	3D PDF	IGES	OBJ	STL	STEP/STP	Other (please specify):
AU	Trademarks, Industrial Designs									Designs do not publish 3D formats. They are used for internal reference only. This is also the case for trade marks.
BG					Industrial designs, Inventions (except 3D chemical structures), Utility models, Inventions (3D chemical structures)
BT	Trademarks	Trademarks	Trademarks		Industrial designs, Inventions (3D chemical structures)
CA			Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)							For inventions (Patents) we search and examine 3D chemical structures using a tool called STN.
CZ
DE			Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)				Trademarks	Trademarks		X3D (it should be discussed to include this format in ST.91, due to the use of this format within the European Union)
EA	Trademarks, Utility models, Integrated circuit topology				Industrial Designs, Inventions (except 3D chemical structures), Inventions (3D chemical structures)
EE					Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models					2D PDF
EM	Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)			Industrial Designs			Trademarks, Industrial Designs	Trademarks, Industrial Designs		X3D, both for Trademarks and Industrial Designs
EP
GB	Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Industrial designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)					Trademarks	Trademarks		The UK IPO also accepts X3D files (as per ST.91) which is not listed above. Integrated Circuit Topology Rights (known in the UK as Semi-Conductor Topography Rights) are an unregistered right in the UK so the UK IPO does not receive any applications/models or images in connection with this right type.
GM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
HU	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
HR			Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Inventions (3D chemical structures)
IT
JP	Integrated circuit topology		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Inventions (3D chemical structures)
KR						Industrial Designs	Industrial Designs	Industrial Designs	Industrial Designs
LT			Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
NA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
RU			Integrated circuit topology, Inventions (3D chemical structures)		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models
SK		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
SY	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)

2.4. What software does your Office currently use for the electronic publication of 3D models, 3D images or 3D chemical structures?

ST.3 Code	Response
AU	Designs do not publish 3D formats. They are used for internal reference only. This is also the case for trade marks.
BG	N/A
BT	Industrial Property Automation System (IPAS)
CA	Not applicable
CZ
DE	web browser is used for visualizing files containing 3d models. The following 3rd party javascript libraries are used: X3DOM for X3D files and jsc3d-library for Wavefront obj and STL (both binary and ascii) files
EA	We use custom tool for conversion of filed 3D formats into 3D PDF, based on the solution implemented in cooperation with FIPS/Rospatent.
EE	2D PDF
EM	JSC3D and X3DOM JavaScript libraries
EP
GB	None
GM	N/A
HR	n/a
HU	NONE
IT
JP	JPO currently doesn't use software for the electronic publication of 3D models, 3D images or 3D chemical structures.
KR	PDF Viewer
LT	-
NA	None
RU	Rospatent uses the in-house developed information system, specifically designed for the IPO given the experts needs and requirements, including visualization and search modules. The system is also capable of creating 3D PDF of each 3D representation filed, that is further published as part of the official e-publication in PDF format at post-registration stage or filed application in line with the publication rules and requirements depending on the IPR type
SK	-
SY	None

2.5. What formats of 3D models, 3D images or 3D chemical structures does your Office currently use for the paper publication for each IP right?

ST.3 Code	None, my Office doesn’t operate this type of IP right	None, my Office doesn’t publish information of this type of IP right on paper	None, my Office doesn’t publish information of 3D models, 3D images or 3D chemical structures on paper even if they were accepted	2D images received by Office from the source 3D models or 3D images	Link to the 3D object online	Other (please specify)
AU		Trademarks, Industrial Deisgns				None, my Office doesn't publish information of this type of IP right on paper. Designs do not publish 3D formats. They are used for internal reference only. This is also the case for trade marks.
BG		Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
BT	Trademarks, Industrial Designs	Trademarks, Industrial Designs	Trademarks, Industrial Designs
CA			Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
CZ
DE			Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)		Trademarks	Paper publications relating to 3d-marks embed a printable QR-Code which contains a link to the 3d model file in DPMAregister
EA	Trademarks, Utility models, Integrated circuit topology	Industrial Designs, Inventions (except 3D chemical structures), Inventions (3D chemical structures)
EE						The publications are only available in electronic form
EM	Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)			Industrial Designs	Trademarks	Note. EUIPO does not publish data on paper format, so the responses refer to the "printable" publication of IP rights data (i.e. gazettes).
EP
GB	Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)			The UK IPO no longer publishes on paper and has not done so for 10+ years
GM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
HR			Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
HU	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
IT
JP	Integrated circuit topology		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Inventions (3D chemical structures)
KR				Industrial Designs
LT		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
NA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Integrated circuit topology, Inventions (3D chemical structures)
RU		Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
SK	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)
SY	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology, Inventions (3D chemical structures)

2.6. Does your Office carry out search for the comparison of the 3D models and 3D images with 3D models and 3D images during the examination process and if so, in what formats for each IP right?

ST.3 Code	No	Yes, my Office uses 2D representations of 3D models for the comparison	Yes, my Office uses 3D models themselves for the comparison	Other (please specify)
AU	Trademarks, Industrial Deisgns			No. We can use a 3D model as a visual aid during the examination process, however it won't be considered an official representation. This implies: The applicant is still required to submit 2D representations. The 3D model won't influence the scope of protection for the design. The 3D model won't be included in the Australian Design Search database, the Australian Journal of Designs, or any certificates. For trade marks, we do not utilise 3D models in the course of examination. The applicant is required to submit a 2D representation for shape marks in isometric or perspective drawings, along with a description of the shape in the form of an endorsement.
BG	Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
BT	Trademarks	Industrial Designs	Industrial Designs
CA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology			CIPO received 2D representation of 3D chemical structures. Employees create a 3D representation in the search tool STN and do a search against the database.
CZ
DE	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
EA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
EE	Trademarks, Industrial Designs	Inventions (except 3D chemical structures), Utility models
EM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
EP
GB	Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology		Trademarks
GM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology			N/A
HR	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
HU	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
IT
JP	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
KR		Industrial Designs
LT	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
NA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
RU	Integrated circuit topology	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models
SK	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
SY	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology

2.7. What software does your Office currently use for the comparison of the 3D models and 3D images with 3D models and 3D images during the examination process? Please specify:

ST.3 Code	Response
AU	Designs are viewed using Adobe Acrobat, which includes a PDF that contains a 3D model. There is no other software used during the examination process that compares 3D models to 3D images. There is no software being used for trade marks.
BG
BT	Industrial Property Automation System (IPAS)
CA	We use STN to compare 2D chemical structures that we receive as part of the application against 3D structures that are in the STN database.
CZ
DE
EA
EE	No any specific software. The experts engage in visual comparison
EM	Not applicable
EP
GB	ACSEPTO is used for examiners & external customers to view 3D models & 3D images for trade marks
GM	N/A
HR	n/a
HU	NONE
IT
JP	JPO currently doesn't use software for the comparison of the 3D models and 3D images with 3D models and 3D images during the examination process.
KR	KIPO does not directly compare 3d images with 3d images during the examination process.
LT	-
NA	none
RU	Rospatent uses the in-house developed information system, specifically designed for the IPO given the experts needs and requirements, including visualization and search modules. Seach module was designed and developed using both statistical and AI methods (Siamese neural network) to carry out search and comparison of 3D visual representations
SK	-
SY	None

2.8. Does your Office carry out search for the comparison of the 3D models and 3D images with 2D images during the examination process and if so, in what formats for each IP rights?

ST.3 Code	No	Yes, my Office uses 2D representations of 3D models for the comparison	Yes, my Office uses 3D representations of 2D images for the comparison	Other (please specify)
AU	Trademarks, Industrial Deisgns
BG		Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
BT	Trademarks	Industrial Designs	Industrial Designs
CA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
CZ
DE	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
EA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
EE	Trademarks, Industrial Designs	Inventions (except 3D chemical structures), Utility models	Inventions (except 3D chemical structures), Utility models
EM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
EP
GB	Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology	Trademarks	Trademarks
GM	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology			N/A
HR	Inventions (except 3D chemical structures), Utility models, Integrated circuit topology	Trademarks, Industrial Designs
HU	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
IT
JP	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
KR		Industrial Designs
LT	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
NA	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
RU	Inventions (except 3D chemical structures), Utility models, Intregrated circuit typology	Trademarks, Industrial Designs
SK	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology
SY	Trademarks, Industrial Designs, Inventions (except 3D chemical structures), Utility models, Integrated circuit topology

2.9. What software does your Office currently use for the comparison of the 3D models and 3D images with 2D images during the examination process?

AU	For 3D Designs models, drawings, and photos are the preferred formats for representations, filed as a PDF using Adobe Acrobat. While we can use a 3D model as a visual aid during the examination process, it won't be considered an official representation. This implies: The applicant is still required to submit 2D representations. The 3D model won't influence the scope of protection for the design. The 3D model won't be included in the Australian Design Search database, the Australian Journal of Designs, or any certificates.
BG
BT	Industrial Property Automation System (IPAS)
CA	Not applicable
CZ
DE
EA
EE	No any specific software. The experts engage in visual comparison
EM	Not applicable
EP
GB	ACSEPTO is used for trade mark searching
GM	N/A
HR	We use standard image (JPG) Windows viewer
HU	NONE
IT
JP	JPO currently doesn't use software for the comparison of the 3D models and 3D images with 2D images during the examination process.
KR	Internal prior design search system and AI image search system which is based on a self-developed model.
LT	-
NA	none
RU	Rospatent uses the in-house developed information system to automatically create 2D views of filed 3D representations as recommended by the Standard, that also allows experts to manually adding other 2D representations. Such an approach is also applied in other in-house developed information systems to carry out similarity search of trademarks and industrial designs 2D representations
SK	-
SY	None

3.1. Please describe existing practices or future plans for using 3D models, 3D images or 3D chemical structures within your Office

ST.3 Code	Changed to “Active”
AU	Designs - ACIP Designs Review Recommendation 21 Decision Regarding Recommendation 21 from the ACIP Designs Review, the acceptance of 3D models for designs, ACIP has concluded that no changes should be made to the designs system at this time in response to 3D printing and scanning technologies. There are currently no existing or future plans to cater for 3D models, images or chemical structures with respect to trade marks.
BG
BT	I don't have specific information regarding the utilization of 3D models, 3D images, or 3D chemical structures within the Office in Bhutan.
CA	During CIPO's modernization of its legacy systems there are plans to look at emerging technologies which could include looking at the need and feasibility of implementing the use of tools for 3D models, 3D images or 3D chemical structures.
CZ	Our office currently uses 2D images throughout the IP right lifecycle. We have noted some interest from applicants regarding the filing of 3D models in the area of industrial designs.
DE	Considering 3D models for Community Designs in future
EA	We plan to introduce search tools for the comparison of the 3D models and 3D images.
EE	There are no plans for the near term
EM	EUIPO currently accepts 3D models (OBJ, STL, X3D) to represent three-dimensional trademarks and designs. When filing a design application with a 3D model, the user must select up to 7 views that will be protected. The EUIPO is undergoing impact assessment for the upcoming legislative reform of the design regulation, which might impact the current practice of the Office.
EP
GB	As noted in our response to Question 1.2 the UK IPO is about to start the second phase of a major IT transformation program. We will be considering our existing and future plans for using 3D models & 3D images at this time.
GM	Our office would like to engage CWS member offices using their 3D tools to learn from best practices before implementation.
HR	No current plan
HU	N/A
IT	Three-dimensional trademarks are accepted, but the filing format of the electronic file is JPEG.
JP
KR	KIPO has introduced 3D images in industrial design since 2010, and efforts are being made to continuously improve performance and stabilize the system by collecting user opinions.
LT	Our office use 2D images of 3D models
NA	We are still reading more on the subject matter.
RU	Currently, 3D representations are considered as supplementary material in applications for trademarks, industrial designs, inventions and utility models. The in-house information system is used for processing applications, containing 3D visual representations. The current work is focused on collecting more 3D representations to properly train the neural network. Furthermore, the work is ongoing to integrate search capabilities into the patent search system, in addition to the trademarks and industrial designs search system.
SK	Office uses 2D representations of 3D models in the JPG file format with file size till to 2 MB a resolution = 300 dpi
SY

3.2. Please describe existing practices or future plans relating to the implementation of WIPO Standard ST.91 within your Office

ST.3 Code	Response
AU	The topic of accepting 3D models for designs was discussed during the ACIP Designs Review Recommendation 21 The historical context surrounding this matter traces back to its introduction, which occurred around the year 2017. Initially, the incorporation of 3D filing options was primarily intended to serve as a visual aid to assist examiners in their tasks. It is important that challenges persist with regard to the publication of such representations on the Australian Designs System (ADS). During that period, our organisation held a supportive stance toward embracing advancing technology and recognising the advantages it presented to both our customers and staff members in the utilisation of 3D files. In principle, the idea of permitting 3D representations as an additional means for design assessment appeared commendable. However, we also had to carefully consider the capabilities of our systems, as well as the essential requirement for 2D representations, particularly for convention filings and to accommodate customers filing in jurisdictions that do not facilitate the use of 3D files. There are currently no such existing or future plans to cater for 3D models, images or chemical structures with respect to trade marks.
BG
BT	For the implementation of WIPO Standard ST.91 within our office, the initial step entails revising our Industrial Property Act of the Kingdom of Bhutan, 2001, particularly focusing on trademarks.
CA	In the event that CIPO uses 3D models, 3D images or 3D chemical structures, CIPO plans to leverage the WIPO Standard.91.
CZ	Our office currently uses 2D images throughout the IP right lifecycle. Due to task prioritization we do not have specific plans to implement ST.91 as of now. We do expect to implement ST.91 if 3D models are adopted within our office in the future.
DE	Future plans depend more on activities of EUIPO rather than on WIPO Standard ST.91
EA	We plan to cover all formats of 3D models and 3D images recommended by the WIPO Standard ST.91.
EE	Under study
EM	As indicated in question 1.2, EUIPO only partially implements ST.91's recommended file extensions. A consultation has been launched with the 3D Task Force to clarify the reasons for excluding the X3D format from the recommended formats in ST.91. Regarding points 11 and 12 in ST.91, which state that 'If required, at an applicant's request the receiving IPO can accept files larger than the said maximum', EUIPO has no plans to alter the current file size limits.
EP
GB	Please see our response to Questions 1.2 & 3.1
GM	Our office does not practice the using of 3D tools as it is not in existence within our office. On that note we would like to be engaged with TF members offices already using the tools to learn from best practices before implementation.
HR	No current plan
HU	N/A
IT
JP
KR	KIPO has fully implemented ST.91 since last December, and we are now working on monitoring the system and performance improvements.
LT	There are no existing future plans for ST.91 WIPO Standard implementation
NA	We are still reading more on the subject matter
RU	Currently, Rospatent fully implements WIPO Standard ST.91
SK	-
SY	In the meetings of the National Committee on the National Intellectual Property Strategy I suggested including 3D models and 3D images of intellectual property laws in Syria, to help creators identify the most appropriate forms of protection for their 3D models and images. Therefore in the future WIPO Standard ST.91 will be used in our office

4. Any other comments. Please specify:

ST.3 Code	Response
AU	N/A
BG
BT	Bhutan has attended the WIPO Standard Committee meeting only once; as a result, we struggle to keep up with international norms.
CA
CZ
DE
EA
EE
EM	None
EP
GB	None
GM	N/A
HR
HU
IT
JP
KR
LT	-
NA	none
RU
SK	-
SY	1- I suggest creating a pilot testing program for WIPO Standard ST.91 and other WIPO standards with Member States to urge Member States to deal with these standards, spread a culture of their use, and ensure practical application and effectiveness in Member States. Updated WIPO Standard ST.91 and other WIPO standards based on feedback from pilot testing program. including guidance on best practices and compliance requirements. 2- Due to the spread of hologram technology and its use in trademarks and advertising, this requires effective protection for it. Therefore, I propose to find a special standard for hologram technology and not on the basis of video or 3D images.